Silicon Micromachining (Record no. 2069)
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| 000 -LEADER | |
|---|---|
| fixed length control field | 02074nam a22002177a 4500 |
| 003 - CONTROL NUMBER IDENTIFIER | |
| control field | OSt |
| 005 - DATE AND TIME OF LATEST TRANSACTION | |
| control field | 20181229123809.0 |
| 008 - FIXED-LENGTH DATA ELEMENTS--GENERAL INFORMATION | |
| fixed length control field | 181229b ||||| |||| 00| 0 eng d |
| 020 ## - INTERNATIONAL STANDARD BOOK NUMBER | |
| International Standard Book Number | 978-0-521-60767-1 |
| 028 ## - PUBLISHER NUMBER | |
| Source | Allied Informatics, Jaipur |
| Bill Number | 5712 |
| Bill Date | 17/12/2018 |
| Purchase Year | 2018-19 |
| 040 ## - CATALOGING SOURCE | |
| Original cataloging agency | BSDU |
| Language of cataloging | English |
| Transcribing agency | BSDU |
| 082 ## - DEWEY DECIMAL CLASSIFICATION NUMBER | |
| Classification number | 621.3815 |
| Item number | ELW |
| 100 ## - MAIN ENTRY--PERSONAL NAME | |
| Personal name | Elwenspoek, M |
| 245 ## - TITLE STATEMENT | |
| Title | Silicon Micromachining |
| 260 ## - PUBLICATION, DISTRIBUTION, ETC. | |
| Place of publication, distribution, etc. | New York |
| Name of publisher, distributor, etc. | Cambridge University Press |
| Date of publication, distribution, etc. | 2004 |
| 500 ## - GENERAL NOTE | |
| General note | This comprehensive book provides an overview of the key techniques used in the fabrication of micron-scale structures in silicon. Recent advances in these techniques have made it possible to create a new generation of microsystem devices, such as microsensors, accelerometers, micropumps, and miniature robots. The authors underpin the discussion of each technique with a brief review of the fundamental physical and chemical principles involved. They pay particular attention to methods such as isotropic and anisotropic wet chemical etching, wafer bonding, reactive ion etching, and surface micromachining. There is a special section on bulk micromachining, and the authors also discuss release mechanisms for movable microstructures. The book is a blend of detailed experimental and theoretical material, and will be of great interest to graduate students and researchers in electrical engineering and materials science whose work involves the study of micro-electromechanical systems (MEMS). |
| 504 ## - BIBLIOGRAPHY, ETC. NOTE | |
| Bibliography, etc. note | Contents:<br/><br/>1. Introduction<br/>2. Anisotropic wet chemical etching<br/>3. Chemical physics of wet chemical etching<br/>4. Wafer bonding<br/>5. Examples and applications<br/>6. Surface micromachining<br/>7. Isotropic wet chemical etching of silicon<br/>8. Introduction into dry etching<br/>9. Why plasmas?<br/>10. Plasma system configurations<br/>11. What is plasma etching?<br/>12. Contact plasma etching<br/>13. Remote plasma etching<br/>14. High aspect ratio trench etching<br/>15. Moulding of microstructures<br/>16. Fabrication of movable microstructures. |
| 650 ## - SUBJECT ADDED ENTRY--TOPICAL TERM | |
| Topical term or geographic name entry element | Electronics |
| 700 ## - ADDED ENTRY--PERSONAL NAME | |
| Personal name | Jansen, H. |
| 942 ## - ADDED ENTRY ELEMENTS (KOHA) | |
| Source of classification or shelving scheme | Dewey Decimal Classification |
| Koha item type | Books |
| Withdrawn status | Lost status | Source of classification or shelving scheme | Damaged status | Not for loan | Collection code | Home library | Current library | Date acquired | Cost, normal purchase price | Total Checkouts | Full call number | Barcode | Date last seen | Date last checked out | Cost, replacement price | Price effective from | Koha item type |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| Dewey Decimal Classification | Not For Loan | Reference | BSDU Knowledge Resource Center, Jaipur | BSDU Knowledge Resource Center, Jaipur | 12/29/2018 | 5964.00 | 1 | 621.3815 ELW | 017682 | 02/12/2020 | 01/04/2019 | 5964.00 | 12/29/2018 | Books |