000			02597nam a22002177a 4500
999			_c2033 _d2033
003			OSt
005			20181205135603.0
008			181205b ||||| |||| 00| 0 eng d
020			_a978-81-8128-546-1
028			_bAllied Informatics, Jaipur _c5670 _d27/11/2018 _q2018-19
040			_aBSDU _bEnglish _cBSDU
082			_a621.381 _bSEN
100			_aSenturia, Stephen D.
245			_aMicrosystem Design
260			_aNew Delhi _bSpringer (India) Pvt. Ltd. _c2015
300			_a689
500			_aIt is a real pleasure to write the Foreword for this book, both because I have known and respected its author for many years and because I expect this book’s publication will mark an important milestone in the continuing worldwide development of microsystems. By bringing together all aspects of microsystem design, it can be expected to facilitate the training of not only a new generation of engineers, but perhaps a whole new type of engineer – one capable of addressing the complex range of problems involved in reducing entire systems to the micro- and nano-domains. This book breaks down disciplinary barriers to set the stage for systems we do not even dream of today. Microsystems have a long history, dating back to the earliest days of mic- electronics. While integrated circuits developed in the early 1960s, a number of laboratories worked to use the same technology base to form integrated sensors. The idea was to reduce cost and perhaps put the sensors and circuits together on the same chip. By the late-60s, integrated MOS-photodiode arrays had been developed for visible imaging, and silicon etching was being used to create thin diaphragms that could convert pressure into an electrical signal. By 1970, selective anisotropic etching was being used for diaphragm formation, retaining a thick silicon rim to absorb package-induced stresses. Impurity- and electrochemically-based etch-stops soon emerged, and "bulk micromachining" came into its own.
504			_aContents: Part I Getting Started Introduction An Approach to MEMS Design Microfabrication Process Integration Part II Modeling Strategies Lumped Modeling Energy-Conserving Trasducers Dynamics Part III Domain-Specific Details Elasticity Structures Energy Methods Dissipation and the Thermal Energy Domain Lumped Modeling of Dissipative Processes Fluids Circuit and System Issues Feedback Systems Case Studies A Piezoresistive Pressure Sensor A Capacity Accelerometer A Piezoelectric Rate Gyroscope DNA Amplification A Microbridge Gas Sensor
650			_aElectronics
942			_2ddc _cBK