000			02074nam a22002177a 4500
999			_c2069 _d2069
003			OSt
005			20181229123809.0
008			181229b ||||| |||| 00| 0 eng d
020			_a978-0-521-60767-1
028			_bAllied Informatics, Jaipur _c5712 _d17/12/2018 _q2018-19
040			_aBSDU _bEnglish _cBSDU
082			_a621.3815 _bELW
100			_aElwenspoek, M
245			_aSilicon Micromachining
260			_aNew York _bCambridge University Press _c2004
500			_aThis comprehensive book provides an overview of the key techniques used in the fabrication of micron-scale structures in silicon. Recent advances in these techniques have made it possible to create a new generation of microsystem devices, such as microsensors, accelerometers, micropumps, and miniature robots. The authors underpin the discussion of each technique with a brief review of the fundamental physical and chemical principles involved. They pay particular attention to methods such as isotropic and anisotropic wet chemical etching, wafer bonding, reactive ion etching, and surface micromachining. There is a special section on bulk micromachining, and the authors also discuss release mechanisms for movable microstructures. The book is a blend of detailed experimental and theoretical material, and will be of great interest to graduate students and researchers in electrical engineering and materials science whose work involves the study of micro-electromechanical systems (MEMS).
504			_aContents: 1. Introduction 2. Anisotropic wet chemical etching 3. Chemical physics of wet chemical etching 4. Wafer bonding 5. Examples and applications 6. Surface micromachining 7. Isotropic wet chemical etching of silicon 8. Introduction into dry etching 9. Why plasmas? 10. Plasma system configurations 11. What is plasma etching? 12. Contact plasma etching 13. Remote plasma etching 14. High aspect ratio trench etching 15. Moulding of microstructures 16. Fabrication of movable microstructures.
650			_aElectronics
700			_aJansen, H.
942			_2ddc _cBK